Descum System
ATST can provide market-proven Wafer (200&300mm) Descum equipment and PLP (Max 600mm) Descum
equipment.
- Plasma equipment used to remove PR residue (scum) remaining after the photolithography process. The Descum process can improve the current and resistance value of the coating process and achieve a stable shape.
- In addition, through the plasma treatment in the Descum process, the properties of the substrate surface can be changed from hydrophobic to hydrophilic, which is conducive to improving the adhesion of the metal film manufactured in the subsequent Sputter process. In the RDL (Re-Distribution Layer) process of Fan-out technology, which has recently received attention in the semiconductor back-end process, improving the surface properties through Descum is an essential process.
Descum Process
